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Semiconductor Packaging for Hardware Product Managers

7 chapters · 32 lessons

1. 1. Packaging Fundamentals for Product Decisions

   4 lessons

   Understand how packaging connects dies, moves data, delivers power, and removes heat in modern systems.

2. 2. 2.5D and 3D Packaging Architectures

   5 lessons

   Compare side-by-side and stacked chiplet approaches to match your product's performance and cost targets.

3. 3. Chiplet Disaggregation Strategy

   4 lessons

   Decide when to split functionality across chiplets versus building a monolithic die.

4. 4. Thermal and Power Delivery Constraints

   5 lessons

   Identify thermal and power bottlenecks that limit performance and reliability in packaged systems.

5. 5. Signal Integrity and Electrical Performance

   4 lessons

   Understand how interconnect quality affects data rates, latency, and error rates in your product.

6. 6. Supply Chain and Foundry Ecosystem

   5 lessons

   Navigate the packaging supply chain from design houses to OSATs and negotiate roadmap commitments.

7. 7. Packaging in Product Roadmaps and Requirements

   5 lessons

   Translate packaging constraints into schedules, specs, and cross-functional communication.